Physical Design Services

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Physical Design

Full Chip Physical Design

Full Chip Physical Design

• Synthesis - Physical and Logical aware.
• DFT scan insertion.
• Hierarchical/Flat Design planning and partitioning.
• Place and Route.
• Clock Tree Synthesis.
• Power analysis and EMIR.
• Low power Checks and LEC.
• Functional Eco implementation.
• Physical Verification and Signoff.
• IP hardening (DDR / MPHY /DPHY / eMMC PHY).

Full Chip Physical Design

Full Chip Physical Design

Full Chip Physical Design

• Bump Planning and Analysis.
• RDL routing from Bump to IO PAD (Signal / Power).
• Chip Top level Power planning.
• 3rd party IP integration.
• IO PAD placement and analysis (Signal / Power).
• IO Ring / Seal Ring creation.
• Special Net manual routing Analog/CLK.
• Core ESD /TCD / ICOVL / BEOL/ FEOL placement.
• Packaging team interaction.

STA

Full Chip Physical Design

STA

• SDC Development.
• Timing Budgeting Chip Top level.
• SI aware timing analysis using noise libs.
• MMMC creation and validation.
• Timing closure functional and test modes.
• Special OCV Derate assessment using ΔV and ΔT.
• Timing Eco implementation (func/shift/capture/bist).